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DESCRIPTION:Microelectronic components present a unique challenge for
materialographic preparation. In microelectronic components\, various mat
erials with widely differing properties are packaged together (glass\, cer
amics\, metals\, and polymers)\, so preparing all materials well can be di
fficult. Additional complications arise from the small size\, complex geom
etry\, and need for controlled material removal to reach a plane of intere
st. Please join us as we discuss Struers&rsquo\; solutions for preparing m
icroelectronic devices.
\n
\nIn this webinar attend
ees will learn about:
\n
\n&bull\; Challenging clam
ping of complex and small samples
\n&bull\; Vacuum impre
gnation to fill vias with epoxy resin
\n&bull\; Controll
ed material removal to reach a plane of interest
\n&bull
\; Excellent scratch-free preparation of materials with varying properties
DTEND:20220525T190000Z
DTSTAMP:20240329T110603Z
DTSTART:20220525T180000Z
LOCATION:
SEQUENCE:0
SUMMARY:Materialographic Preparation and Evaluation of Microelectronic Devi
ces
UID:2492ddcb-d3fd-44c8-93fb-0d7dd7d9cb1e
X-ALT-DESC;FMTTYPE=text/html:Microelectronic components present a uni
que challenge for materialographic preparation. In microelectronic compone
nts\, various materials with widely differing properties are packaged toge
ther (glass\, ceramics\, metals\, and polymers)\, so preparing all materia
ls well can be difficult. Additional complications arise from the small si
ze\, complex geometry\, and need for controlled material removal to reach
a plane of interest. Please join us as we discuss Struers&rsquo\; solution
s for preparing microelectronic devices.
\n
\nIn th
is webinar attendees will learn about:
\n
\n&bull\;
Challenging clamping of complex and small samples
\n&bu
ll\; Vacuum impregnation to fill vias with epoxy resin
\n&bull\; Controlled material removal to reach a plane of interest\n&bull\; Excellent scratch-free preparation of materials with v
arying properties
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